Gigabit Ethernet TDM Module
With the Gigabit Ethernet TDM module it is possible to double the capacity of Gigabit Ethernet. With the time division multiplexing (TDM) technology two Gigabit Ethernet data streams (2x 1.25 Gbps 1000Base-X) are combined to one channel (1x 2.5 Gbps). This aggregation is completely transparent for each Gigabit Ethernet channel. Switch features such as VLANs, stacked VLANs, Flow Control, buffer management etc. are not affected. The Gigabit Ethernet TDM is equipped with SFP slots for modularity of the optical interfaces. For xWDM applications the line interface can be equipped with a coloured SFP transceiver. For the installation into a 3 U or 4 U Modular Access Platform chassis, the adapter plate must be used. Each adapter plate occupies 6 slots and can hold 2 TDM Modules.
Features:
- Module for 19” Enterprise Access and Metro Platform
- 3 modular ports with pluggable SFPs
- TDM for 2x Gigabit Ethernet
- Efficient use of capacity
- Cost reduction for long haul applications
- Simple increase of available transmission capacities
- Direct connection to MICROSENS xWDM multiplexer
- SNMP manageable via MICROSENS NMP-Platform
- Integrated management agent for local and remote unit
Specifications:
Type: Time Division Multiplexing (TDM) Module for MICROSENS modular chassis system
Function: Transparent multiplexing of 2 independent Gigabit Ethernet channels on one single 2.5 gbps fibre port.
Interfaces: 2x local Gigabit Ethernet 1000Base-X (SFP), 1x line 2.5 gbps (SFP) and 1x terminal port (RS-232) for local craft terminal (9600 bps, 8N1, VT100 emulation)
LED Display:
Power: green - Normal operation
green, blink- Loopback on port
red - Module or transceiver failure, Transceiver missing
off - Module not powered
Line status: green - Normal operation
yellow - Far-end LOS
red - Loss-Of-Signal (LOS), Transceiver failure
off - No link on port
Local status 1&2: green - Normal operation
yellow - GBE far-end LOS, Transmission corrupted
red - GBE LOS, Transceiver failure
Adapter Chassis: For mounting the TDM module in 3U Modular Access Platform chassis. Size (w x h): 6 slots x 3 U
Power Supply: 12 V DC, max. 15 W via backplane
Operating temperature: 0°C to 55°C
Storage temperature: -20°C to 80°C
Relative humidity: 5% to 80% non condensin g
