ML700 Ethernet Access Devices

ML700 Ethernet Access Devices

The ML700 family of Ethernet Access Devices delivers high speed Carrier Ethernet services over up to 8 bonded copper pairs utilizing VDSL2/ADSL2+/ADSL2/ADSL technologies. ML700 can support up to 420Mbps downstream and up to 160Mbps upstream. All ML700 platforms come in a compact 1RU high by half rack width wide, hardened, fixed form factor that can be flexibly deployed either as an EAD/NTU in a Point-To-Multi-Point scenario, or at both ends of the link in a Point-To-Point scenario.ML700 link rate and reach can be extended using Actelis’ BBA Broadband Amplifiers (VBA or ABA). The ML700 offer MEF compliant services, 802.1q VLAN-aware wire-speed bridging, double tagging (VLAN stacking), advanced provisioning using Ethernet Virtual Connections (EVCs), L2, L3 and L4 classification with flexible mapping into eight traffic classes to maximize the efficiency of access bandwidth. The ML700 can be deployed within Actelis’ compact enclosures offering integrated remote or local power modules for ease of installation.

ML700 EADs offer the highest link resilience and best-in-class customer Quality of Experience (QoE) through its unique implementation of SRA (Seamless Rate Adaptation) and Impulse Noise Protection (INP) mechanisms in accordance with G.inp for unsurpassed bonded-link reliability. The ML700 EADs provide proactive and dynamic tools for enhanced trouble shooting and monitoring capabilities. Advanced Carrier-class EFM OAM, including 802.3ah, CFM (802.1ag) and Y.1731 (ITU), are  incorporated, offering both physical link as well as service level end-to-end advanced troubleshooting mechanisms. The ML700 EADs can be managed In and Out-of-Band by the Actelis’ MetaASSIST™ View and via the multi-platform Element Management System, MetaASSIST EMS. The management protocols include standard command line interface and SNMP using standard MIBs for seamless integration with third-party Network Management Systems (NMS).

ML700 Ethernet Access Devices

The ML740 Ethernet Access Devices (EADs) delivers up to 260/160 Mbps of bandwidth (downstream/upstream), with extended reach, using standard EFM bonding over 2, 4 or 8 copper pairs by utilizing DMT (ADSL2/2+ and VDSL2) technology. The ML740 family of EADs delivers the longest reach with the greatest reliability and the most cost-effective solution for high bandwidth DSLAM and next-generation mobile backhaul (HSPA+ and LTE, Small Cell) applications. In addition to best-in-class rate and reach capabilities, ML740 EADs offer the highest link resilience and best-in-class customer Quality of Experience (QoE) through its unique implementation of SRA (Seamless Rate Adaptation) and Impulse Noise Protection (INP), and complying with G.inp for unsurpassed bonded link reliability. All ML740 EADs are hardened and compact devices. ML740 models offer 5 X 10/100BaseT ports and 2 SFPs 100/1000BaseFX ports.


  • Best-in-class Rate Reach & Reliability
  • Best-in-Class Link Resilience, Implementing G.inp
  • CE 1.0 - MEF 9, 14
  • IEEE 802.3ah EFM, ITU-T G.998.2 Solution
  • Advanced SLA Monitoring
  • Environmentally Hardened
  • BBA for rate and reach extension - up to 100 Mbps at 12 kft/4 km (24 AWG, 0.5 mm)
  • IGMP Snooping

Specifications for ML740:

Ethernet (Network/User) Interfaces:

  • 10/100Base-T: 4 ports, Connector: RJ45, Auto-MDIX
  • 100/1000Base-FX: 2 ports, Connector: SFP based, MSA compliant

High Speed Link (Bonded Copper Pairs):

  • Protocol: IEEE 802.3ah 2Base-TL
  • DMT Multimode: ITU-T G.992.3 (ADSL2), G.992.5 (ADSL2+), G.993.2 (VDSL2) supporting multiple VDSL profiles with auto line code selection
  • Impulse Noise Protection: G.INP (ITU-T G.998.4) and Interleaved modes for bonded links
  • Bandwidth: Up to 420 Mbps - aggregated; 260 Mbps downstream + 160 Mbps upstream
  • Number of Copper Pairs: 2, 4 or 8; Connector: RJ45 (per modem/pair)
  • End-to-end Delay: 2-4 ms (typical)
  • Sealing Current: 48VDC/1.5mA nominal

Management (Out-of-Band):

  • 10/100Base-T: Connector: RJ45, Auto-MDIX
  • Craft: EIA RS-232 (DCE), Connector: DB9

LAN Protocols:

  • Dynamic Bridging: IEEE 802.1, 8K MAC addresses
  • Discovery Mechanisms: LLDP
  • VLAN Tagging: IEEE 802.1Q
  • Double Tagging: Q-in-Q
  • RSTP, STP: IEEE 802.1d
  • Link Aggregation: IEEE 802.3ad
  • Provider Bridges: IEEE 802.1ad
  • OAM: IEEE 802.3ah clause 57 (EFM OAM), IEEE 802.1ag, ITU Y.1731

Management Protocols:

  • SNMP: SNMP V1 and V2C
  • Command Line Interface: TL1, Industry Standard CLI
  • Remote Access: Telnet
  • Secure Access (option): SSH v2
  • Time Synchronization: SNTP v3
  • Web Access: HTTP
  • File transfer: FTP, TFTP
  • IEEE 802.3ah EFM OAM
  • User Authentication: RADIUS and/or local passwords

Management Applications: EMS: MetaASSIST EMS; Craft GUI: MetaASSIST View

EVCs: 8
Mapping Rules: 16 ingress rules (Port/VLAN/L2/L3/L4 Flexible)
Bandwidth Profiling: CIR, CBS, EIR, EBS per EVC
Frame Marking: 2 rate, 3 color traffic management (green, yellow, red) ingress policing
CoS Marking: Per EVC L2/L3 marking

Quality of Service: Classes of Service: 8; Scheduler: WFQ, SP, Hybrid; Classification: L2 802.1p/Q priorities, L3 ToS/Diff Serv
Dimensions: Height: 1.6” / 40 mm (1U); Depth: 11.0” / 280 mm; Width: 8.4” / 213 mm
Weight: 3.75 lbs / 1.7 kg
Mounting Rack: 2 units in 19”, 23” or ETSI racks Desktop, Wall Mount
Power: DC: -40/-60 VDC (-48V nominal), 21-25W (per model); AC: 90-264 VAC, 47-63 Hz, 31W (worst case); Remotely powering the BBA for extended reach and rate over the data lines.
Operating Temp: -40° to +65°C*
Storage Temp: -40° to +85°C
Relative humidity: Up to 95%, non-condensing
Metro Ethernet Forum: MEF 9, 14 compliant
Safety: UL 60950, CSA C22.2 60950; EN 60950, IEC 60950
EMC: FCC Part 15 Class B; ICES-003 Class B; ETSI EN 300 386 Class B; ETSI ETS 300 132-2
NEBS: Level III (GR-1089-CORE, GR-63-CORE)
CE: EMC and Safety
Telecom: ITU-T K20, K.21
Environmental: GR-63-CORE, ETSI ETS 300 019

Live Demo of FRM220 Chassis

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